1 / 3 www.asb.co.kr october 2009 p lerow tm aln0 07 0wt internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for th e use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performan ce of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surfac e - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 60 80 gain db 21 22 gain flatness db 0.2 0.3 noise figure db 0.9 0. 9 5 output ip3 (1) dbm 25 27 s11/s22 (2) db - 1 8 / - 1 0 output p1db dbm 16 17 sw itching time (3) m sec supply current ma 40 60 supply voltage v 5 impedance w 50 max. rf input power dbm c.w 23~25 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 c to +85 c. 1) oip3 is measured with tw o tones at an output power of 4 dbm/tone separated by 1 mhz. 2) s11, s22(max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 2 rf in 5 rf out 6 v s other s ground feature s s 21 = 22 .2 db@ 60 mhz = 21 .8 db@ 80 mhz nf of 0. 9 db over fr e quency unconditionally stable single 5 v supply high oip3 at low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion (recommended footprint) aln0 07 0wt asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) 1 - stage s ingle type description specifications (in pr o duction) typ.@t = 25 c, v s = 5 v, freq. = 70 mhz, z o.sys = 50 ohms ou t line drawing (unit: mm) solder stencil area
2 / 3 www.asb.co.kr october 2009 p lerow tm aln0 07 0wt internally matched lna module s - param e ters noise figure oip3 p1db 60~80 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 3 www.asb.co.kr october 2009 p lerow tm aln0 07 0wt internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) d c blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are i n clu d- ed inside the aln module. therefore, c1 & c2 capacito rs may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process 20~40 sec 260 c 200 c 150 c 60~180 sec ramp - up (3 c/sec) ramp - down (6 c/sec) in out vs size 25x25 mm (f or aln - at, bt, wt, t series C 10x10 mm) + - aln out in c1 c2 v s tantal or mlc (multi layer c e ra mic) c a pacitor evaluation board layout
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